Joint‐Inspired Liquid and Thermal Conductive Interface for Designing Thermal Interface Materials with High Solid Filling yet Excellent Thixotropy (Adv. Funct. Mater. 14/2023)

Performance and testing of thermal interface materials

The increasing power and reduced die size of CPUs used in computers increases a need for significantly improved thermal interface materials (TIM). The TIM is used to reduce contact resistance at the CPU-heat sink interface. This work provides a state-of-the-art assessment on “thermal interface materials,” including fundamentals, materials used, their performance, and how interface resistance is...

Enhancement of thermal interface materials with carbon nanotube arrays

This paper describes an experimental study of thermal contact conductance enhancement enabled by carbon nanotube (CNT) arrays synthesized directly on silicon wafers using plasma-enhanced chemical vapor deposition. Testing based on the one-dimensional reference bar method occurred in a high-vacuum environment with radiation shielding, and temperature measurements were made with an infrared camer...

Evaluation of Thermal Interface Materials and the Laser Flash Method

Title of Document: EVALUATION OF THERMAL INTERFACE MATERIALS AND THE LASER FLASH METHOD Vinh Khuu, Doctor of Philosophy, 2009 Directed By: Chair Professor, Michael Pecht, Department of Mechanical Engineering Thermal interface materials (TIMs) are used to reduce the interfacial thermal resistance between the chip and the heat sink, which has become a bottleneck to heat removal in a variety of el...

Liquid-solid interface inertia

Photoacoustic Technique for Thermal Conductivity and Thermal Interface Measurements

The photoacoustic (PA) technique is one of many techniques for characterizing thermal conductivity of materials, including thermal interface conductance or resistance. Compared with other techniques, the PA method is relatively simple, yet is able to provide accurate thermal conductivity data over a wide range of materials and properties. In the last decade, the PA method has been developed and...